01557nam\a2200325\a\4500 12352717 BD-KhUET 20121212164208.0 121212s2001 nyua 000 0 eng 2001030752 0071363270 DLC DLC BD-KhUET 621.381046 21 Lau, John H. 143 Microvias : for low-cost, high-density interconnects / John H. Lau, S.W. Ricky Lee. New York : McGraw-Hill, c2001. xxiii, 565 p. : ill. ; 24 cm. Microelectronic packaging. 144 Integrated circuits Design and construction Cost control. 145 Semiconductors Junctions. 146 Printed circuits. 8168 Lee, S. W. Ricky. 147 Contributor biographical information http://www.loc.gov/catdir/bios/mh041/2001030752.html Table of contents http://www.loc.gov/catdir/toc/mh031/2001030752.html Publisher description http://www.loc.gov/catdir/description/mh031/2001030752.html ddc BK 8437 8437 0 0 ddc 0 0 KUETCL KUETCL GEN 2004-06-15 Asia Foundation 0.00 0 621.381046 LAU 3010032505 2012-12-12 00:00:00 1 2012-12-12 BK